Breaking News
Comments
Newest First | Oldest First | Threaded View
Zeev00
User Rank
Author
re: IEDM goes deep on 3-D circuits
Zeev00   12/13/2012 5:59:03 AM
NO RATINGS
I am somewhat uncomfortable pointing this out, but the Stanford/Monolithic3D/Rambus IEDM paper (14.2) about heat extraction has absolutely nothing to do with TSVs. It talks about heat removal using inter-layer-vias of the Power Delivery Networks in monolithic 3D devices that have no TSVs. Just sayin'

krisi
User Rank
Author
re: IEDM goes deep on 3-D circuits
krisi   12/12/2012 3:50:54 PM
NO RATINGS
thank you Don and doc Divakar...any more news from IEDM anyone?

docdivakar
User Rank
Author
re: IEDM goes deep on 3-D circuits
docdivakar   12/11/2012 7:46:05 PM
NO RATINGS
1 saves
The paper on reliability discussing the "Effect of Local Deformation Caused by Cu-TSVs..." has important implications to the placement of TSV's and the keep-out rules. This is something that is still developing and has many process-dependent influences (via middle or via last etc.) as well as type of stacking (die to die vs. wafer to wafer) and the die thickness. Regrettably I could not attend IEDM this year but would be great to see more review articles as Kris also comments above. MP Divakar

Don Scansen
User Rank
Author
re: IEDM goes deep on 3-D circuits
Don Scansen   12/11/2012 4:36:12 AM
NO RATINGS
Thanks Kris. I will see what else I can dig up.

krisi
User Rank
Author
re: IEDM goes deep on 3-D circuits
krisi   12/10/2012 6:56:32 PM
NO RATINGS
Interesting summary Don...looking forward for more details from IEDM this week...Kris



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...