I am somewhat uncomfortable pointing this out, but the Stanford/Monolithic3D/Rambus IEDM paper (14.2) about heat extraction has absolutely nothing to do with TSVs. It talks about heat removal using inter-layer-vias of the Power Delivery Networks in monolithic 3D devices that have no TSVs. Just sayin'
The paper on reliability discussing the "Effect of Local Deformation Caused by Cu-TSVs..." has important implications to the placement of TSV's and the keep-out rules. This is something that is still developing and has many process-dependent influences (via middle or via last etc.) as well as type of stacking (die to die vs. wafer to wafer) and the die thickness.
Regrettably I could not attend IEDM this year but would be great to see more review articles as Kris also comments above.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used on the Mars on EE Times Radio. Live radio show and live chat. Get your questions ready.