This looks like (at least) a dual gate oxide SoC, so it's definitely more expensive to make than single gate oxide logic. Triple gate oxide is not unheard of either. The gate layer in this case is therefore already triple patterned for non-lithographic, electrical reasons alone.
Everyone who plays/played the "Master of Orion" or the "Civilization" series of global/galactic strategy games knows that "raping the tech tree" is the key to victory. I can't see how that's any different for the semiconductor industry and the process technology tree.
TSMC has an infrastructure and process to enable IP houses to develop analog, memory and other process-specific IP. That way anyone who uses the new process can choose from many offering. That's my understanding why Intel's mobile offerings are so poor-featured compared ARM-based developed by Qualcomm, Samsung and Nvidia. Tri-gate process is a great improvement and the step in the right direction to enable mobile market, but I am not sure if this is sufficient alone. Even if Intel opens its fab to others today, it still has a lot to catch up with the way other fabs are supporting their customers. Thanks for the interesting article!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.