The US is safer bet for wafer fabs in my opinion since they involve huge capital investments, are mostly automated, and need a few PhD EE's and IE's and a specially trained crew of tool maintenance technicians (perhaps trained by the tool vendors or even managed by tool vendors). Moving inland from the two coasts has proven safer and cheaper.
And the smart money will invest in US for fabs, and Asia for final manufacturing and test, as in the 80's. Fab Automation makes that best mix in my opinion seeing that chips are tiny things that can be shipped anywhere, but $10billion fabs are safer here that in many locales (as is the IP involved in the design-process integration).
Yes, companies will put their manufacturing where they can get the best return for the investment. As long as the corporate tax is higher in Europe, Asia will continue to grow as the manufacturing center of the world.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.