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MaggieC
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re: Five More Tough DesignCon Questions
MaggieC   1/15/2013 11:17:00 PM
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I noticed your comments about materials so here are some thoughts: the industry is moving beyond just using conventional FR4. Most of the change is geared toward the raw materials, like resin, glass fabrics and copper, as well as a focus on hybrid constructions that utilize multiple types of laminates in the same PCB. Spread glass is becoming popular again because of its more consistent rates of the signal speeds. We are also looking at material combinations that may function differently. Some layers of an interconnect may require high-speed materials, while other parts might only require FR4, or you may have a combination of materials on different layers. Another reason for the move to hybrid constructions is to lower costs, as high-speed laminates can reach 15x the cost of standard materials. Additionally, there is usually much more material used on a higher layer board. Another important change is the move to lead free-assemblies in order to conform with international standards for eco-friendly products. Dale Kersten, Vice President Operations, Global Engineering, Sanmina

rick merritt
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re: Five More Tough DesignCon Questions
rick merritt   1/4/2013 10:01:38 PM
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What questions do you have about high speed design?



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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