I noticed your comments about materials so here are some thoughts: the industry is moving beyond just using conventional FR4. Most of the
change is geared toward the raw materials, like resin, glass fabrics and
copper, as well as a focus on hybrid constructions that utilize multiple
types of laminates in the same PCB. Spread glass is becoming popular again because of its more consistent rates of the signal speeds. We are also looking at material combinations that may function differently. Some layers of an interconnect may require high-speed materials, while other parts might only require FR4, or you may have a combination of materials on different layers. Another reason for the move to hybrid constructions is to lower costs, as high-speed laminates can reach 15x the cost of standard materials. Additionally, there is usually much more material used on a higher layer board. Another important change is the
move to lead free-assemblies in order to conform with international
standards for eco-friendly products. Dale Kersten, Vice President Operations, Global Engineering, Sanmina
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.