Embedded Systems Conference
Breaking News
Comments
krisi
User Rank
Author
re: UMC copper process targets power management ICs
krisi   1/16/2013 3:37:54 PM
NO RATINGS
20% lower resistance doesn't sound like much...I am surprised that would developed a special process option for this...why not use it across the board?

docdivakar
User Rank
Author
re: UMC copper process targets power management ICs
docdivakar   2/21/2013 10:55:23 PM
NO RATINGS
Kris, this is about a decade-old technology developed by TI (was using 15micron Cu back then) and was used in its Swift group of Power Management products. The TPS54672 (with integrated MOSFETs) used a 0.8um BiCMOS process in a TSSOP PowerPAD package and the die used thick Cu in an RDL process which was done typically in a backend fab in those days. I believe the process technology was developed by Unitive with TI's active participation (Unitive has since been a part of Amkor). Since the Swift product days, the backend metallization for thick Cu has further improved. The article doesn't mention about patent claims TI had that prevented a number of other PMIC companies from using this technology. MP Divakar

Peter Clarke
User Rank
Author
re: UMC copper process targets power management ICs
Peter Clarke   1/16/2013 6:45:18 PM
NO RATINGS
Well copper is highly contaminating in a fab, so I suspect that UMC/Chipbond are plating copper on to a die as final metal layer step, possibly out of the fab. So then the question is one of desiging PMICs for greater current and thermal performance and which conventional BCD processes you apply the thick-copper plating.

Kresearch
User Rank
Author
re: UMC copper process targets power management ICs
Kresearch   1/16/2013 8:56:51 PM
NO RATINGS
It is just a marketing tactic to combine UMC(wafer Foundry) and Chipbond(Bumping house) services. Solution would be like typical RDL process. Anything new? It seems not.

Clif Tsai
User Rank
Author
re: UMC copper process targets power management ICs
Clif Tsai   1/17/2013 8:50:45 PM
NO RATINGS
Hope the wafer-packaging foundry collaboration will be smart enough to create a robust interconnect system using Cu wire/bump to resolve some of the Cu-based interconnect issues in assembly process and reliability.



Most Recent Comments
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

An Appetizing Archive of Propitious & Pragmatic Resources
Max Maxfield
Post a comment
Quite a few Pooh Sticks have drifted under the bridge since I first came into contact with my chum and fellow EE Times blogger Adam Taylor. It all started when I read one of Adam's columns ...

Jack Ganssle, Embedded.com

Processor Pinups
Jack Ganssle, Embedded.com
4 comments
My wife and I joke about our “adult” magazines. For her, those are the publications about beading. For me, they’re tool catalogs and Fine Woodworking magazine. The latter ...

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll