The technical press would rather focus on the shiny new penny, like DSA (which I cannot imagine was involved in the production of this wafer, but is indicative of the power of the media in making something out of nothing), than on ex-shiny new pennies like imprint. While EUV (soft x-ray) and maskless (EBDW) continue to flail despite their name changes, imprint continues to make quiet progress, particularly with NVM, which is less defect sensitive. Plus the NVM market is the most elastic, thanks to SSD, and imprint is cheap. Also, imprint solved EUV's intractable source, mask, and resist problems years ago. EBDW's problems remain intractable, as they have been for some 20+ years.
According to the report below, it looks like Intel is using a 450mm tool developed by Molecular Imprints. http://450mm.com/blog/2013/01/21/a-plan-coming-together-450mm-patterned-wafers/
Here are some close up pictures of the wafer.
Congratulations to Molecular Imprints. It's good to see another nanoimprint litho company get into 450-mm. Almost two years ago EV Group, which also provides NIL systems, worked with SEMATECH to pattern a 450-mm wafer using NIL, as reported in the industry press. Yet another positive step on the road to 450-mm with this latest news.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.