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walken1
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re: Imprint litho firm claims 450-mm first
walken1   1/18/2013 11:04:36 PM
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Congratulations to Molecular Imprints. It's good to see another nanoimprint litho company get into 450-mm. Almost two years ago EV Group, which also provides NIL systems, worked with SEMATECH to pattern a 450-mm wafer using NIL, as reported in the industry press. Yet another positive step on the road to 450-mm with this latest news. http://www.electroiq.com/articles/sst/2011/july/how-evg-accomplished-1st-450mm-printed-wafer.html

geekmaster
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re: Imprint litho firm claims 450-mm first
geekmaster   1/18/2013 11:31:42 PM
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Sounds very promissing! I thought 450mm will begin to use 14nm or 10nm. Was any 14nm or 10nm demonstrated?

resistion
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re: Imprint litho firm claims 450-mm first
resistion   1/19/2013 4:29:59 AM
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Imprint is an attractive process, but it transfers lithographic difficulties (resolution, overlay, defects) to a different substrate than silicon.

resistion
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CEO
re: Imprint litho firm claims 450-mm first
resistion   1/22/2013 12:44:59 AM
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The company is unnamed but Intel is showing the imprinted wafer (?).

goatech
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re: Imprint litho firm claims 450-mm first
goatech   1/22/2013 4:22:07 PM
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According to the report below, it looks like Intel is using a 450mm tool developed by Molecular Imprints. http://450mm.com/blog/2013/01/21/a-plan-coming-together-450mm-patterned-wafers/ Here are some close up pictures of the wafer. http://www.xbitlabs.com/news/other/display/20130118174430_Intel_Demonstrates_Industry_s_First_Fully_Patterned_450mm_Wafer_Photos.html

John_V
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re: Imprint litho firm claims 450-mm first
John_V   1/22/2013 5:17:31 PM
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I looked into this and discovered that apparently EVG was only able to pattern a few fields with no alignment and 35nm-plus features. Also the EVG tool could not produce thousands of wafers in time.

John_V
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re: Imprint litho firm claims 450-mm first
John_V   1/22/2013 5:18:36 PM
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Do we know if DSA was used in this wafer?

Diogenes53
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re: Imprint litho firm claims 450-mm first
Diogenes53   1/27/2013 6:27:02 PM
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The technical press would rather focus on the shiny new penny, like DSA (which I cannot imagine was involved in the production of this wafer, but is indicative of the power of the media in making something out of nothing), than on ex-shiny new pennies like imprint. While EUV (soft x-ray) and maskless (EBDW) continue to flail despite their name changes, imprint continues to make quiet progress, particularly with NVM, which is less defect sensitive. Plus the NVM market is the most elastic, thanks to SSD, and imprint is cheap. Also, imprint solved EUV's intractable source, mask, and resist problems years ago. EBDW's problems remain intractable, as they have been for some 20+ years.



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