Neither Smith nor CEO Paul Otellini indicated where the 450-mm development facility would be located. Intel already has two wafer fabs that have been previously labeled as being destined for 450-mm wafer production; the D1X fab in Hillsboro, Oregon and Fab 42 in Chandler, Oregon.
bad architecture? x86 you mean? 450mm wafer makes the cost more tolerable and x86 can better compete with ARM atleast at the low end which is now what Intel is targeting with their Africa smartphone release I guess.
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