Neither Smith nor CEO Paul Otellini indicated where the 450-mm development facility would be located. Intel already has two wafer fabs that have been previously labeled as being destined for 450-mm wafer production; the D1X fab in Hillsboro, Oregon and Fab 42 in Chandler, Oregon.
bad architecture? x86 you mean? 450mm wafer makes the cost more tolerable and x86 can better compete with ARM atleast at the low end which is now what Intel is targeting with their Africa smartphone release I guess.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.