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resistion
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re: Qualcomm joins IMEC core CMOS R&D program
resistion   2/2/2013 3:18:59 AM
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@supersonic76, I was checking up on this. Indeed, I would think even 32 nm hp is not yet nailed down, given the serious LER (well exceeding 10%). That's why there has even been talk of EUV being used in double patterning context, like complementary lithography proposed by Intel. Of course, consideration of double patterning defeats purpose of considering EUV. http://www.euvlitho.com/2012/P36.pdf

de_la_rosa
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re: Qualcomm joins IMEC core CMOS R&D program
de_la_rosa   1/31/2013 4:30:11 PM
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I wish eetimes would report facts rather than buy into the politics

de_la_rosa
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re: Qualcomm joins IMEC core CMOS R&D program
de_la_rosa   1/31/2013 12:56:36 PM
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Perhaps true for resist and process R&D. Difficult to see the benefits for chip manufactures though since there is no evidence asml's EUV platform can print below 32nm. Correct me if i am wrong.

Peter Clarke
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re: Qualcomm joins IMEC core CMOS R&D program
Peter Clarke   1/30/2013 6:39:19 PM
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I believe they run test structures. There is some data that is private and some that is communal. I suspect some wafers are communal and some private and confidential. Things like lithography metrics benefit from totalling everybodies' wafers.

de_la_rosa
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re: Qualcomm joins IMEC core CMOS R&D program
de_la_rosa   1/30/2013 3:22:56 PM
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Do u mean test structures at 22nm or below? Because this is where i get confused. Has anybody seen decent results from an EUV platform? I saw once a 32nm half pitch pattern about 6 months ago.

resistion
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re: Qualcomm joins IMEC core CMOS R&D program
resistion   1/30/2013 9:40:59 AM
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Certainly the technology would be available to all the member companies. But considering that the member companies use IP to compete with one another, this shared technology cannot be called IP.

eewiz
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re: Qualcomm joins IMEC core CMOS R&D program
eewiz   1/30/2013 4:09:13 AM
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Shared IP, as is in a license to use the IP and know how. Obviously patent assignee, which you can find from a patent search, is usually a single entity

resistion
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re: Qualcomm joins IMEC core CMOS R&D program
resistion   1/30/2013 12:40:36 AM
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For technologies which are equally extremely high risk to all companies (like EUV), it makes sense to have the collaboration model, with actual data and information being shared. For technologies of unequally high risk (like FinFETs) the value may be realized only for some companies, e.g., Qualcomm instead of Intel in the case of FinFETs.

resistion
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re: Qualcomm joins IMEC core CMOS R&D program
resistion   1/29/2013 10:48:02 PM
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Patent search will show how rare shared IP really is. Practically nonexistent. Shared IP is an oxymoron.

resistion
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re: Qualcomm joins IMEC core CMOS R&D program
resistion   1/29/2013 10:41:34 PM
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As outside observer, they're paying for advance information on processes below 22 nm. But individual companies make their own decisions.

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