The article clearly needs to emphasize the metric current density vs. current magnitude whether effective, RMS or average values! Temperature effects are of course important but current densities all the way to chip-to-chip (in case of 3D / 2.5D IC) and chip-to-package-level interconnects. Metal lines in IC can take 1E6 Amp/cm^2 current density but interconnects (flipchip or wirebond) and TSV's have lower limits.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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