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docdivakar
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re: Addressing signal electromigration (EM) in today’s complex digital designs
docdivakar   1/29/2013 8:53:03 PM
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The article clearly needs to emphasize the metric current density vs. current magnitude whether effective, RMS or average values! Temperature effects are of course important but current densities all the way to chip-to-chip (in case of 3D / 2.5D IC) and chip-to-package-level interconnects. Metal lines in IC can take 1E6 Amp/cm^2 current density but interconnects (flipchip or wirebond) and TSV's have lower limits. MP Divakar



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