Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
any1
User Rank
CEO
re: ISSCC: ASML says EUV best option at 10nm
any1   2/20/2013 1:24:53 AM
NO RATINGS
EUV missed insertion at 14 nm for Intel and I've heard before that Intel thinks 10nm is possible without EUV. Where does that leave TSMC, GLOFO, and Samsung? Will Intel gap them by another node before EUV is ready?

Alex33
User Rank
Rookie
re: ISSCC: ASML says EUV best option at 10nm
Alex33   2/19/2013 6:07:13 PM
NO RATINGS
Not at metal1. Every node a few more restrictions creep in, but it is nothing close to unidirectional. You won't get enough pin placements in the std cells without allowing 2D designs.

kjdsfkjdshfkdshfvc
User Rank
Rookie
re: ISSCC: ASML says EUV best option at 10nm
kjdsfkjdshfkdshfvc   2/19/2013 2:34:39 PM
NO RATINGS
Wow, I just learned me something. http://bit.ly/dI3hcF

resistion
User Rank
CEO
re: ISSCC: ASML says EUV best option at 10nm
resistion   2/19/2013 1:30:56 PM
NO RATINGS
"..no one uses wire bends anymore..." It's true, layouts would be almost entirely cut lines.

greenpattern
User Rank
Rookie
re: ISSCC: ASML says EUV best option at 10nm
greenpattern   2/19/2013 11:37:37 AM
NO RATINGS
The first slide showed power fluctuations of more than 10% - is that normal?

resistion
User Rank
CEO
re: ISSCC: ASML says EUV best option at 10nm
resistion   2/19/2013 10:14:15 AM
NO RATINGS
ASML promised 70 WPH @ 15 mJ/cm2, but what if that dose is not enough? What if need 60? They cannot ever be the cost-effective solution.

double-o-nothing
User Rank
Rookie
re: ISSCC: ASML says EUV best option at 10nm
double-o-nothing   2/19/2013 10:06:03 AM
NO RATINGS
The 18 nm hp holes show large non-uniformity and the 13 nm hp lines much roughness. The end result is not just ASML's optics, it's also the resist and the mask blank defects. It's also interesting they still need multiple patterning to extend EUV's usability. Also, I'm pretty sure no one uses wire bends anymore at such small scales.

<<   <   Page 2 / 2


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).