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re: Infineon ships power ICs from floppy 300-mm wafers
daleste   2/22/2013 2:40:24 AM
Do they actually process the wafers thru the fab when they are thin? That would lead to many issues for conformity across the wafer during critical process steps. I think what they are saying, is that they thin the wafer (back grind) after processing. They are just making the wafer thinner than most semiconductor suppliers. I guess this gives them better heat conduction. I don't see how this gives them a cost advantage.

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re: Infineon ships power ICs from floppy 300-mm wafers
VNP   2/21/2013 1:29:36 PM
My wife said that it is easy to handle such kind of pancake. "Just use the pan", she said.

Ryan Tennill
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re: Infineon ships power ICs from floppy 300-mm wafers
Ryan Tennill   2/20/2013 5:16:45 PM
Do wafers actually become "floppy" when thinned to this degree? I see the image but it still seems that the lattice structure would prevent that degree of deflection. Manufacturing on floppy wafers would actually be very good because it could significantly ease wafer handling requirements.

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re: Infineon ships power ICs from floppy 300-mm wafers
krisi   2/19/2013 4:03:43 PM
40um thick 30cm wafer, pretty amazing! If that was a pizza it would be very low calories meal ;-)

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re: Infineon ships power ICs from floppy 300-mm wafers
kjdsfkjdshfkdshfvc   2/19/2013 2:36:23 PM
Technology never ceases to amaze me. Except "tech" from Apple. That amazes no one. http://bit.ly/dI3hcF

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