Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
daleste
User Rank
Author
re: Infineon ships power ICs from floppy 300-mm wafers
daleste   2/22/2013 2:40:24 AM
NO RATINGS
Do they actually process the wafers thru the fab when they are thin? That would lead to many issues for conformity across the wafer during critical process steps. I think what they are saying, is that they thin the wafer (back grind) after processing. They are just making the wafer thinner than most semiconductor suppliers. I guess this gives them better heat conduction. I don't see how this gives them a cost advantage.

VNP
User Rank
Author
re: Infineon ships power ICs from floppy 300-mm wafers
VNP   2/21/2013 1:29:36 PM
NO RATINGS
My wife said that it is easy to handle such kind of pancake. "Just use the pan", she said.

Ryan Tennill
User Rank
Author
re: Infineon ships power ICs from floppy 300-mm wafers
Ryan Tennill   2/20/2013 5:16:45 PM
NO RATINGS
Do wafers actually become "floppy" when thinned to this degree? I see the image but it still seems that the lattice structure would prevent that degree of deflection. Manufacturing on floppy wafers would actually be very good because it could significantly ease wafer handling requirements.

krisi
User Rank
Author
re: Infineon ships power ICs from floppy 300-mm wafers
krisi   2/19/2013 4:03:43 PM
NO RATINGS
40um thick 30cm wafer, pretty amazing! If that was a pizza it would be very low calories meal ;-)

kjdsfkjdshfkdshfvc
User Rank
Author
re: Infineon ships power ICs from floppy 300-mm wafers
kjdsfkjdshfkdshfvc   2/19/2013 2:36:23 PM
NO RATINGS
Technology never ceases to amaze me. Except "tech" from Apple. That amazes no one. http://bit.ly/dI3hcF



Radio
LATEST ARCHIVED BROADCAST
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...