Do wafers actually become "floppy" when thinned to this degree? I see the image but it still seems that the lattice structure would prevent that degree of deflection. Manufacturing on floppy wafers would actually be very good because it could significantly ease wafer handling requirements.
Do they actually process the wafers thru the fab when they are thin? That would lead to many issues for conformity across the wafer during critical process steps. I think what they are saying, is that they thin the wafer (back grind) after processing. They are just making the wafer thinner than most semiconductor suppliers. I guess this gives them better heat conduction. I don't see how this gives them a cost advantage.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.