Sounds like you suggest non-memory firms still processing on 200mm. But I can guess that intel production is 100% 300mm at this time, and likely that Intel and TSMC will be first to 450mm, with samsung close behind.
It is not surprising that the memory suppliers lead the way into the larger wafers. Then the foundries follow. The cost of installing 300mm capacity is huge. You have to have the volume to amortize the cost, or you can play the game. Thus the quote "only real men have fabs".