Sounds like you suggest non-memory firms still processing on 200mm. But I can guess that intel production is 100% 300mm at this time, and likely that Intel and TSMC will be first to 450mm, with samsung close behind.
It is not surprising that the memory suppliers lead the way into the larger wafers. Then the foundries follow. The cost of installing 300mm capacity is huge. You have to have the volume to amortize the cost, or you can play the game. Thus the quote "only real men have fabs".
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.