I guess it's another example of hybrid "Si" laser with III-V and Si wafer bonding technology pioneered by UCSB/intel and some European teams. In another report, they claim they still have some problems with waveguide to laser coupling which is critical for any practical uses. I guess they can't use grating coupler as Luxteta has protected this little trick with a bunch of patents. Anyway, we will see how it looks like in the upcoming OFC.
@laser_jock, it refers to 100G because of the IEEE 100GbE LR4 (4x25G) standard.
If you put four 25Gbps lasers on a chip, are you allowed to call this a 100Gbps laser?
There would appear to be a wide gap between the press release title and what may have been actually demonstrated.
Some have other names for such a gap, 'factor of 4 or 10' comes to mind.
How about the reliability ? Luxtera bonds laser chip on CMOS wafer, what's the difference ? Only laser is not enough, has Skorpios developed receiver, modulator...with high perfomance ? Infinera has realized WDM on chip on III-V platform, will Skorpios's solution be cheaper and better ?
Laser in CMOS!...this will be huge if it works as advertised!!...we would love to have this technology presented at CMOS Emerging Technologies symposium in Whistler this JUly (www.cmosetr.com), if anyone at Skorpios is interested pls contact me, firstname.lastname@example.org
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.