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Videobub
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re: Party down with the March caption contest
Videobub   3/8/2013 7:24:57 PM
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Levity, levitation. Same difference guys! Either one means a bad joke happens, right?

kteam42
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re: Party down with the March caption contest
kteam42   3/8/2013 7:22:07 PM
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Even at a party, Bob always has to try and show everyone else up.

BrainiacV
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re: Party down with the March caption contest
BrainiacV   3/8/2013 7:22:04 PM
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Proofreading e-mails before sending is essential. It should have read "There will be no more clowning around at meetings." The omission of the word, "no" was unfortunate.

plink
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re: Party down with the March caption contest
plink   3/8/2013 7:20:14 PM
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You simply attach it to the balloon.. and it goes up into the cloud.

Silverlock
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re: Party down with the March caption contest
Silverlock   3/8/2013 7:14:06 PM
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"So, to keep this meeting lighthearted, anyone who wishes to speak must first breathe in some helium from his or her balloon."

OmegaMan
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re: Party down with the March caption contest
OmegaMan   3/6/2013 5:34:29 PM
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Bob made his point about shrinking profits and ballooning costs.

Model A
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re: Party down with the March caption contest
Model A   3/6/2013 5:06:24 PM
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This year, our corporate R&D tax credits from the polititians in Washington are nothing but hot air.

bnowak0
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re: Party down with the March caption contest
bnowak0   3/6/2013 4:25:29 PM
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A group of engineers putting a box of condoms to use, the only way they know how...

seaEE
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re: Party down with the March caption contest
seaEE   3/6/2013 5:20:13 AM
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"So we cut the weight of our product by 1/3 at about two pennies additional cost."

JeffL_2
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re: Party down with the March caption contest
JeffL_2   3/5/2013 8:41:12 PM
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...and under the old retirement plan we received a lot of complaints from employees that upper management was getting so-called "golden parachutes", or unfairly lucrative deals compared with what the average employee receives, so we came up with this new system which is clearly much more equitable. Any questions?

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michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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