The statement "Using 3-D transistors instead of the previous planar structure transistors, pipeline stages can be vertically stacked on top of each other, effectively reducing the distance between blocks and eliminating wire delay effects." is correct in respect to the advantage associated with monolithic 3D technology, but it has nothing to do with the Fin-FET transistor also known as 3-D transistor. You can find more information in "MonolithIC3D.com" web site
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.