Very interesting views of Messrs. Tai and Li of RDA and Spreadtrum - thank you Junko.
RDA is now a leading vendor of silicon-integrated feature phone basebands (BB + XCVR + PMU + WLAN + BT) and RF PAs -- about $500M+ run rate. What impresses me with the fast growing mainland China IC vendors are their enterpreneurial and innovative approaches, including in IC packaging.
One can be certain that RDA will soon be a major user of low-cost high-performance wafer-level solutions, leading, like Spreadtrum, the industry transition from wire-bond to wafer-level packaging. All are warning signs to their global IC competitors in the fast changing mobile landscape.....
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.