From your desciption it appears that strictly speaking the new Xilix module ( just like their first one ) is NOT a 3-d but 2.5d ( i,e. no pesky TSVs in active dies, only in Si interposers and no stacking of active dies ).
Can you comment please.
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...