From your desciption it appears that strictly speaking the new Xilix module ( just like their first one ) is NOT a 3-d but 2.5d ( i,e. no pesky TSVs in active dies, only in Si interposers and no stacking of active dies ).
Can you comment please.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.