Design Con 2015
Breaking News
Newest First | Oldest First | Threaded View
User Rank
re: 3-D integration takes spotlight at ISPD
Francoise.vonTrapp   4/2/2013 10:51:36 PM
I asked Liam Madden that question during his keynote at 3D ASIP, to which he replied, "to an engineer, it's 2.5D. To the marketing department, it's 3D IC." Hope that helps.

User Rank
re: 3-D integration takes spotlight at ISPD
chipmonk0   3/26/2013 5:28:49 PM
Colin : From your desciption it appears that strictly speaking the new Xilix module ( just like their first one ) is NOT a 3-d but 2.5d ( i,e. no pesky TSVs in active dies, only in Si interposers and no stacking of active dies ). Can you comment please.

Most Recent Comments
Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).