Clearly the dimension scaling is getting more and more challenging, for less and less benefits. Accordingly there are less and and less vendors who still doing it, it is clearly the time to consider other options - of which monolithic 3D IC would be a most compelling one
Of course 14 nm node will be difficult to achieve. But it will be one more way for semiconductor industry "leaders" to differentiate themselves from their competitors. And it will likely drive yet more consolidation in the industry.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.