"The test chip was implemented using a commercially available tool chain and design services provided by companies associated with ARM and TSMC."
Did TSMC provide by any chance SEM cross sections?
I am curious about fin height variations for example
what's the shape look like?
Do they look similar to Intel
On April 9, ARM talk on "New ARM Architectures for Servers: 64 bit, Virtualization, and Energy Efficiency". Attend event in San Jose or on-line: http://sites.ieee.org/scv-cs/ by IEEE Computer Society Santa Clara Valley
"New ARM Architectures for Servers: 64 bit, Virtualization, and Energy Efficiency".
I want to see cross sections.
I want to know Fin height variations within a die and across the wafer.
I don't need some marketing BS
A spokesperson for TSMC has told me that they won't be putting out any SEM cross-sections of the 16FF process until ICs made using the process have been sold.
Once that happens third parties can buy some chips, take a saw to a chip and take their own microphotographs. So TSMC may leave it up to those third parties or release some of their own.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.