Tsmc 28nm yield are now outstanding. Not true at other foundries.
Tsmc on track for more than 1M 28nm wafers a year. With average die sizes of 50-70mm2 that is resulting in about 600-700 good die per wafer or 600-700M / chips per year just out of 28nm alone.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.