Tsmc 28nm yield are now outstanding. Not true at other foundries.
Tsmc on track for more than 1M 28nm wafers a year. With average die sizes of 50-70mm2 that is resulting in about 600-700 good die per wafer or 600-700M / chips per year just out of 28nm alone.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.