Resistion I think it is always possible to affix any or value definition you wish to hp (usually defined as half distance between minimum features). The self assembly (S-A) process) must be considered as independent of lithography. The distance between the S-A oxide discs will be defined by the chemical-oxidation process and added as a sub-lithographic overlay onto the best conventional lithographic process; in my example 20nm lithography. The S K Hynix 1Gb PCM that I covered in one of my earlier EETimes PCM papers was an example of a 42nm minimum feature size resulting in a 2F^2 cell with an hp of 42nm.
Again, in Part 2 above my “d” was the diameter of the oxide discs and that has nothing to do with lithography.
Maybe you can say hp is 20 nm and the cell is 4*hp^2, but if hp is 4x diameter, the cell is 4*16*d^2 or 64d^2. Some schools use hp as F some use d as F. Although hp is more in tune with lithographic requirements, d is more in tune with actual process requirements.
Resistion- Perhaps you can share with us the basis of your conclusion. In my figure 9 above, consider the example of 5nm oxide discs (your nano particles) and a fill factor of 50% for a 20 x 20nm (I.e F =20nm) aperture just over 10 discs are required. Even if you square-packed the discs in the same 20 x 20nm aperture so they were all touching each other a simple calculation shows 16 discs would be required.
The nano particles (discs) are sub-lithographic features so the number of them and the diameter should be independent of the lithographic feature size F. Assuming you are using F in the conventional manner as minimum lithographic feature size in my square aperture example the cell size will be dependent on the lithographic feature size as 4F^2.
The main questions that have to be answered for self-assembly (S-A) is can the discs be produced with diameters of less than 5nm and more importantly will the claimed low reset current density be observed.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.