I wonder about the increased power dissipation for the power supplies and the processor. Will this help with overall power but at the expense of chip heating? I do like the reduced parts count, lowered cost and reduced board space!
Conservation of energy rules. Power dissipated on chip is the nergy previously dissipated on board. It might even be less as Haswell got its own internal power management scheme. Peak power might be the same, but average consumption might be less. And a s previously mentionned, with less headaches for integration. Intel address more the retailer than the consumer.
This really reduces headache for a system designer by limiting the number of external voltage supplies to two. But not sure how it helps for low power consumption for the chip, since, now the voltage regulators are included in the package...may be those are more optimized to get max efficiency in all different operating conditions?
Intel’s Haswell puts more analog inside
Maybe Intel is persuing mixed signal foundry business....
Microsemi Corporation engages in the design, manufacture, and marketing of analog and mixed-signal integrated circuits (ICs) and semiconductors primarily in the United States, Europe, and Asia. Its products include radio frequency (RF) and power components, analog and RF ICs, standard and customizable system-on-chip solutions, and mixed-signal and radiation-tolerant field programmable gate arrays.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.