Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
Phononscattering
User Rank
Manager
re: Chipmakers turn to new process for sub-nm DRAM cells
Phononscattering   6/15/2013 10:28:34 PM
NO RATINGS
The claims in your patent only mention this stack to be deposited on a semiconductor substrate, not a metal electrode, if I am not mistaken? There is also an important difference: The Material in the ZAZ stack is crystallized. The Al2O3 interlayer is not used to prevent crystallization. There was only a very short time when amorphous HAH or ZAZ stacks were used. Elpida and Micron did this in their 70-100nm products. They switched to crystalline stacks later.

Phononscattering
User Rank
Manager
re: Chipmakers turn to new process for sub-nm DRAM cells
Phononscattering   6/15/2013 10:05:04 PM
NO RATINGS
inventyan: The claims in your patent only mention this stack to be deposited on a semiconductor substrate, not a metal electrode, if I am not mistaken? There is also an important difference: The Material in the ZAZ stack is crystallized. The Al2O3 interlayer is not used to prevent crystallization. There was only a very short time when amorphous HAH or ZAZ stacks were used. Elpida and Micron did this in their 70-100nm products. They switched to crystalline stacks later.

inventyan
User Rank
Rookie
re: Chipmakers turn to new process for sub-nm DRAM cells
inventyan   6/10/2013 3:12:03 PM
NO RATINGS
Cann't believe my multilayer (US Patent #6,407,435) is used in actual device now! A multilayer dielectric stack is provided which has alternating layers of a high-k material and an interposing material. The presence of the interposing material and the thinness of the high-k material layers reduces or eliminate effects of crystallization within the high-k material, even at relatively high annealing temperatures. The high-k dielectric layers are a metal oxide of preferably zirconium or hafnium. The interposing layers are preferably amorphous aluminum oxide, aluminum nitride, or silicon nitride. Because the layers reduce the effects of crystalline structures within individual layers, the overall tunneling current is reduced. Also provided are atomic layer deposition, sputtering, and evaporation as methods of depositing desired materials for forming the above-mentioned multilayer dielectric stack.

resistion
User Rank
CEO
re: Chipmakers turn to new process for sub-nm DRAM cells
resistion   6/9/2013 3:48:58 AM
NO RATINGS
Samsung 20 nm DRAM patterning still cost-effective enough, it seems. http://itersnews.com/?p=437

Chipguy1
User Rank
CEO
re: Chipmakers turn to new process for sub-nm DRAM cells
Chipguy1   6/8/2013 8:16:42 PM
NO RATINGS
With micron-elpida merger....world is down to just 3 DRAM players with 75% of the production in Korea. I suspect that might be the endpoint of consolidation and give Samsung an advantage in end devices.

RedSoxRick
User Rank
Rookie
re: Chipmakers turn to new process for sub-nm DRAM cells
RedSoxRick   6/8/2013 3:09:45 PM
NO RATINGS
Buried Word Line: This reads like the Patented technology developed by Qimonda

getty
User Rank
Rookie
re: Chipmakers turn to new process for sub-nm DRAM cells
getty   6/8/2013 6:08:10 AM
NO RATINGS
Dear Mr. Choe, Please email me. Jiyong Kim(hbt100@naver.com)

resistion
User Rank
CEO
re: Chipmakers turn to new process for sub-nm DRAM cells
resistion   6/8/2013 12:00:52 AM
NO RATINGS
Hi, last figure cannot be any clearer?

arno_x
User Rank
Rookie
re: Chipmakers turn to new process for sub-nm DRAM cells
arno_x   6/7/2013 10:53:31 PM
NO RATINGS
Nice article. Thanks.



Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).