Would 3-D stacking of chips be really necessary for Altera at 14 nm from Intel - unless they decide to put SERDES on separate chips ? In that case who would stick / stack them together ? Intel / OSATs ?
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.