Would 3-D stacking of chips be really necessary for Altera at 14 nm from Intel - unless they decide to put SERDES on separate chips ? In that case who would stick / stack them together ? Intel / OSATs ?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.