Embedded Systems Conference
Breaking News
Comments
Oldest First | Newest First | Threaded View
resistion
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
resistion   6/17/2013 1:37:43 PM
NO RATINGS
Very interesting. I wonder if they are seeking immunity from increasingly likely SK DRAM domination.

kjdsfkjdshfkdshfvc
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
kjdsfkjdshfkdshfvc   6/17/2013 2:36:37 PM
NO RATINGS
Sounds pretty sweet. http://bit.ly/IC4m9t

eetimesloyal
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
eetimesloyal   6/17/2013 9:56:59 PM
NO RATINGS
wrong article for the title subject

Dr_Trevorkian
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
Dr_Trevorkian   6/17/2013 10:59:48 PM
NO RATINGS
Wrong article for the title...

resistion
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
resistion   6/18/2013 1:15:14 AM
NO RATINGS
Where did the original article go? I thought it was most significant development from Intel since strained silicon.

resistion
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
resistion   6/18/2013 1:19:12 AM
NO RATINGS
and also trigate, HKMG.

jeffreyrdiamond
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
jeffreyrdiamond   6/18/2013 3:51:37 PM
NO RATINGS
Click on the "NEXT" button at the bottom of the page - the title is just one behind. :) (EETimes, I just saved you for free.)

shikantaza
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
shikantaza   6/18/2013 6:56:58 PM
NO RATINGS
Ah, the stuff you can do when you control your own fab process! Intel dropped DRAM - their original product line - over 30 years ago because they were going to get clocked by the Japanese. IBM's eDRAM really opened up single-chip architecture as eDRAM fabbed with a logic process enables an attached processor to really scream. Logic transistors are generally crap for analog, but if you own the process you can compensate. TSVs? Gotta have 'em. As signal paths, they aren't as good as on-chip contacts, but they beat a package any day. Pretty good for cooling, too. Once you have eDRAM and TSVs together, you can get more speed by implementing a honkin' wide bus with fewer buffer stages. Intel is REALLY good at watching research, then incorporating results into its new devices. They (ahem) borrowed heavily from a project I worked on to create the super-wide high-speed networks in Ivy Bridge and Haswell. The other thing to remember about Intel is that they almost certainly have stuff already working in the lab RIGHT NOW that is probably 4-5 years ahead of the commercial state of the art, and are figuring out how to manufacture stuff for the 2020 market. They are really great at maturing technologies before releasing them, allowing their investments on present-day technologies to be paid for. I can hardly wait to see what path they'll follow to bring carbon into the market. That, I gar-on-tee, will change everything. I don't know if they'll be the first, but they'll be close.

resistion
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
resistion   6/18/2013 8:11:38 PM
NO RATINGS
Noticed 45W power draw for Haswell L4 Gb, and this is with 22 nm ultralow leakage.

asdfasw
User Rank
Author
re: Intel eDRAM attacks graphics in pre-3-D IC days
asdfasw   6/20/2013 1:11:47 AM
NO RATINGS
How is this eDRAM?? Intel is using a separate chip for DRAM, then connecting CPU and DRAM together on package! While IBM's is true eDRAM, with the DRAM on the processor DIE itself.



Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
6 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll