Rework station BGA500 of GLICHN, 3 temperature zones with chinese and english touching screen, 3 groups of temperature profiles can be show at the same time, 30 groups of temperature data can be stored. BGA,CSP, LGA( Land Grid Array), Micro SMD, MLF (Micro-Lead Frame ),BCC ( Bumped Chip Component ) and other chips can be deal. it is best equipment for PCB especially large PCB. More models like BGA510C which is with CCD camera and computer, BGA400, BGA310, BGA180D which is IR solder station; XBOX, motherboard and mobiles can be repaired using them, they are repair station and rework system; solder and desolder can be finished. On www.smtchn.com, more specification can be seen.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.