Good questions, and I look forward to hearing many answers.
Here are mine:
TSMC is the main source for the fabless world so they already hold the top ranking with the exception of Intel that is the sole source of a FinFET capability today but limited to a few cherry-picked customers. The issue for TSMC is not to lose its position by letting GloFo or others get to the next major semiconductor capabilty before them.
As for chip designers, only a few dozen groups that still do custom IC layout will need to understand and leverage the details of FinFETs. The rest of the chip design crowd will probably just see FinFETs as a term roughly synonomous with an advanced process versus a legacy one. That said, anyone in electronics who follows the underlying semiconductor technology and speifies foundry servcies probably knows and tracks milestones like this one.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.