Building the fab at the time that Flash chips experience some shortage seem to be short sighted. By the time the fab is build you will likely be in excessive inventory situation again. Does anyone care to comment? Kris
I agree that Fab 5 Phase 2 could make, at some point 3D ReRAM components.
I believe that Toshiba referenced 3D memories to cover both 3D NAND and 3D ReRAM. The conventional wisdom, coming from the likes of Toshiba-SanDisk, IMEC, Intel-Micron is that 3D-NAND will precede 3D-ReRAM.
But if you think it will be otherwise please tell.
Toshiba has got the right re-entry in the Flash Battle with 3D Nand Flash, Flash Memory needs has been getting incresed day by day due to replacment of Magnetic Harddisks in PC/Portables. Even entire video industry has got shifted over Flash based media replacing the Tapes. This is really requireing high capacity Flash Drives and 3D Nand Flash is really the right answer to it.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.