Breaking News
Comments
eewiz
User Rank
Author
Latest Rumour
eewiz   7/15/2013 8:33:40 AM
NO RATINGS
The latest rumour from Korea is that Apple is going to use Samsung Fab's again.

http://english.hankyung.com/news/apps/news.view?c1=&newscate=1&nkey=201307150718011

It makes sense for Apple to diversify the chip supply chain .

 

 

Peter Clarke
User Rank
Author
Re: Latest Rumour
Peter Clarke   7/15/2013 8:39:50 AM
NO RATINGS
The Korea Economic Daily sees it as Samsung winning business at the 14-nm FinFET node in 2015 after losing out to TSMC at 20-nm for 2014.

mcgrathdylan
User Rank
Author
Re: Latest Rumour
mcgrathdylan   7/15/2013 1:48:13 PM
NO RATINGS
Agree. The best thing for Apple would be to be able to use TSMC, Samsung and Globalfoundries. Then it could play them all against each other and wind up with the best deals.

m00nshine
User Rank
Author
Re: Latest Rumour
m00nshine   7/15/2013 3:33:31 PM
NO RATINGS
Where is evidence of US fab plan for TSMC? As I know it was media speculation based on Chang comments only that he wouldn't rule it out as a possibility. This is not like any plan. Then later he was more firm and said basically TSMC would stay concentrated in Taiwan to make best utilization benefit.

Peter Clarke
User Rank
Author
Re: Latest Rumour
Peter Clarke   7/16/2013 3:56:44 AM
NO RATINGS
Back in December 2012 Morris Chang was quoted as saying that his company is looking for a location for a wafer fab and that the US is one of the places under consideration.

http://www.eetimes.com/document.asp?doc_id=1262913

 

 

 

 

 

docdivakar
User Rank
Author
Re: Why GlobalFoundries Should Appeal to Apple
docdivakar   7/15/2013 4:46:33 PM
NO RATINGS
I think flashing $1 billion in front of GloFo at this juncture would be serious enough for it to give Apple a serious consideration BUT GloFo can do more outside of Apple's business. GloFo should certainly leverage its USA fab presence to its advantage while there is a trend toward more on-shoring.

While majority of the MEMS market is still dominated by players with the IDM-model, GloFo can leverage its experience with its MEMS fabs to advance the fabless model for MEMS.

MP Divakar

JimMcGregor
User Rank
Author
Re: Why GlobalFoundries Should Appeal to Apple
JimMcGregor   7/15/2013 6:06:15 PM
NO RATINGS
There is a fourth option to consider that would also be interested in the funding: UMC.

While I agree that it makes sense for Apple to use multiple foundies, this can still be a challenge, not only because of differences in processes, but also cost. Using multiple fabs will require new mask sets for each fab, even if they are on the same or similar processes. Although Samsung and GF's processes are likley to be somewhat similar, the fab resources used by Samsung are not part of the Common Platform alliance. So, I doubt that it is the same process.  Also, Apple has already invested a significant amount into having dedicated resources at Samsung.

A few other items to consider are services, IP, and IP protection. Samsung and TSMC both offer more extensive services, IP, and IP protection than the other foundries, which are all considerations. In other words, switching from one fab to another is not like going to a grocery store across the street. It is a major engineering effort with a significant cost. As a result, any change takes time. In the end, I would expect to see two of the foundries, not more, manufacturing for Apple, and even then, they may be manufacturing different products.

Peter Clarke
User Rank
Author
Re: Why GlobalFoundries Should Appeal to Apple
Peter Clarke   7/16/2013 4:00:14 AM
NO RATINGS
I agree that moving a particular complete IC design from one foundry to another is probably a thing of the past.

Also agree that IP blocks DO need to be moved. 

So the pathway may be to make Processor A in foundry X and Processor B in foundry Y.

Whether there needs to a foundry Z to make Processor C appears to be what Apple is juggling with.

rick merritt
User Rank
Author
Who knows?
rick merritt   7/15/2013 7:41:18 PM
NO RATINGS
I would be surprised if someone responsible for foundry relations at Apple was NOT talking to GloFo and Intel as well as IBM, TSMC and Samsung.

But we will probably never know the story unless we find an Ed Snowden of Apple who will become instantly unemployable.

Who makes Apple's XYZ is an interresting soap opera--the Downton Abbey of electronics--but in the end methinks it signifies nothing.

 

 

Peter Clarke
User Rank
Author
Re: Who knows?
Peter Clarke   7/16/2013 4:13:40 AM
NO RATINGS
@Rick


Signifies nothing?

Well, in the long term the issues of these companies may not amount to a hill of beans in this crazy world.

But in the medium-to-short term an Apple purchasing decision can make or break a supplying company which can in turn affect very many other component purchasers and shareholders.



Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Most Recent Comments
Like Us on Facebook
Special Video Section
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...