Resistion-I am philosophically opposed to memory devices or for that matter any solid state electronic devices where thermal input (Joule heating) is essential for operation. (I exclude temperature detecting junctions and thermistors). Certainly 200C MRAM is better than 600+C for PCM. However, almost irrespective of the temperature, in the end attempts at lithographic scaling will hit the r^2/r^3 problem. Where the ability to generate heat by Joule heating (the volume) is reducing at a faster rate than it is being lost (from thre surface area) accompanied by thermal crosstalk. Heating should have gone out with the vacuum tube and the tungsten filament lightbulb.
If it was my money I would be looking for an MRAM solution that did not require heating.
When O when will someone develop a memory technology that is non-volatile (with almost infinite read/write cycles), that boasts extremely low power consumption, with the speed of SRAM (or greater) and the density od DRAM (or greater)?
I'm sure it will happen ... I just don't knwo when...
The funding decision is most likely based in part on the fact that the competition, FeRAM, PCM and ReRAM have still not put clear blue water between them and MRAM and its potential. The time a technology has been around is material but not key. PCM has been around 50 years, FeRAM longer than that, I worked on a FeRAM memory (single crystal Barium Titanate and TGS) more years ago than I really care to remember. In all of these developments hope springs eternal. The measure of sucess is products that are competitive in price, performance and relaibility. But above all design-in wins, that will drive the cost and price down.
The 200C claim for magnetic Curie temperature is impressive and merits further investigation.
Not sure how the funding decision is done in this case. MRAM technology is around already for last couple of years or more (e.g. Everspin). But I think this technology will have take longer strides. The max memory size available is 16Mbits and that too it cost more than 10-20 times of the cost of its volatile counter-parts. Does not really make sense. Reading through the article I saw that the memory could have operating temperature of 200 degC? Is that the junction temeperature?
Microcontrollers with MLU is going to pass all EMC tests required for CE marking?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.