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resistion
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Re: Thermal barrier
resistion   7/22/2013 10:27:46 PM
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@chipmonk0: yes you covered a lot more. A current thinking was 2.5 D (which is really 2D w/TSV interposer) can avoid the thermals initially. But even this may not work with SOI chips, though that's another story entirely.

chipmonk0
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CEO
Re: Thermal barrier
chipmonk0   7/22/2013 1:40:47 PM
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Several thermal solutions using very different aproaches are under development / being implemented at Micron and IBM / 3M. The real barrier is very involved process, low yield & high cost. Simplifications / modifications to the current industry process flow along the lines of my original post are sorely needed.

resistion
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CEO
Thermal barrier
resistion   7/21/2013 3:16:53 AM
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The barrier to TSV acceptance is largely thermal. Layers of insulation still present significant thermal resistance.

chipmonk0
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CEO
Re: Semicon Showed Support for 3D ICs
chipmonk0   7/19/2013 8:59:05 AM
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FYI it is not possible to bond ( / "weld" ) one Tungsten filled via directly to another in the next die stacked on top. At least not at any acceptable temperature anyway. So another layer of metal has to be deposited first to cap the W vias. Then these cap layers are CMPed, and whats really great, instead of using traditional metallurgical bonding that require high temperature ( 250 C ) and pressure, are bonded at quite low temperatures in which electrons are actually shared between atoms across the interface. Co-valent bonds develop and Van der Waals forces contribute to bond strength. There are a lot of tricks in the CMP step but its Good Science overall and reduces residual stress in the stack !

 

As to your "wield" getting misinterpreted by another poster as "weld", in this case two wrongs ( his typo & my responding to his post ) certainly made one right. Because as explained above "weld" is relevant in the case of die stacking.

And now I shall retire to my "weald", to use an old Anglo Saxon term

Peter Clarke
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Blogger
Re: Semicon Showed Support for 3D ICs
Peter Clarke   7/19/2013 4:26:39 AM
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Tungsten wielding ....in other words tungsten using ....not welding

 

 

docdivakar
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Re: Semicon Showed Support for 3D ICs
docdivakar   7/18/2013 8:09:13 PM
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@Chipmonk0: I should have put "Tungsten wielding" in quotes -was meant to be a pun on Peter's comment! And there was a typo! Tezzaron does use Tungsten TSV's in the "FaStack Stacking Technology." Tungsten acts as a good stress-relieving conduit for thermo-mechanical forces.

MP Divakar

chipmonk0
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CEO
Re: Semicon Showed Support for 3D ICs
chipmonk0   7/18/2013 6:50:02 PM
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Tungsten " welding " ?! What is the mp of Tungsten - even with activated sintering. What are they teaching at ASU these days ?

Thats not how the stacked vias are bonded in this case. Are you really all that familiar with the Co.s using W filled vias ?

At the SemiCon talk I gave enough credit to the innovators. It is just that due to business reasons can't go on the record.

docdivakar
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Manager
Re: Semicon Showed Support for 3D ICs
docdivakar   7/18/2013 5:35:42 PM
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@Peter, I think you can fearlessly say the word Tezzaron for Tungsten welding expertise!  But in all fairness, we need to give small companies credit for taking the risk to advance 3D technologies that were hitherto the domains of big ones like Intel, Micron & IBM etc.

MP Divakar

chipmonk0
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CEO
Re: TSMC where are you?
chipmonk0   7/18/2013 2:18:09 PM
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Rick : I have always liked your to the point coverage. You, and the sadly departed Mark Lapedus. But he is continuing at Semiconductor Manufacturing,..

Peter Clarke
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Blogger
Re: Semicon Showed Support for 3D ICs
Peter Clarke   7/18/2013 1:50:30 PM
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@Chipmonk0

And what is the name of that small tungsten-wielding company outside Chicago?

Please share.

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