Breaking News
Comments
Oldest First | Newest First | Threaded View
<<   <   Page 2 / 2
any1
User Rank
CEO
Re: 2 Questions
any1   8/7/2013 1:41:23 PM
NO RATINGS
This is an interesting development. I think it is likely that Samsung knows, along with every other major player in the memory business, that 3D NAND is just a question of when not if.  Then, it may make sense to get some early learning on volume manufacturing of this technology a node or two ahead of when you think you will actually need it.  You can do all of the modeling of cost, device physics, processing, etc.  But until you actually do it on a higher volume basis you really don't know what you don't know.

So I would call 3D NAND a "More than Moore" approach since the minimum feature size is actually getting larger.  It only makes sense if it produces a better device at a lower cost than the 2D equivalent.  And this remains to be determined.

krisi
User Rank
CEO
how many electrons?
krisi   8/7/2013 3:23:09 PM
NO RATINGS
The article states that the new memory cell relies of electron trapping. So how many electrons are trapped to store 1? Can anyone offer an educated guess? Kris

pseudoid
User Rank
Manager
Baby Steps
pseudoid   8/7/2013 3:43:56 PM
NO RATINGS
Our industry needs to continue with attempts to never make our esteemed colleague Gordon E. More wrong! 

I know we are getting there in small baby steps, including the eventuality of 3D fab. 

At the current time, the bottleneck appears to be with the copper interconnects (physical throughput speed limit).  I can't wait for the day when finally Samsung and Intel cross paths at match.com and start courting each other.  "Hello 3D NAND! Please meet Silicon Photonic ICs." ;)

"We have been developing process technology to create a monolithic, photonic sub-system. We build these just like you build any other kind of IC, in a standard chip factory," states Intel's Rattner

Pasted from <http://www.electronicsnews.com.au/features/what-bottleneck-silicon-photonics-technology-boost>

chipmonk0
User Rank
Manager
Re: Stacked 3d package for stacked NAND chips
chipmonk0   8/8/2013 11:33:10 AM
NO RATINGS
@Peter Clarke : Thx in advance.

resistion
User Rank
CEO
Delay?
resistion   4/19/2014 8:55:33 PM
NO RATINGS
<<   <   Page 2 / 2


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Engineer's Bookshelf
Caleb Kraft

The Martian: A Delightful Exploration of Math, Mars & Feces
Caleb Kraft
6 comments
To say that Andy Weir's The Martian is an exploration of math, Mars, and feces is a slight simplification. I doubt that the author would have any complaints, though.

The Engineering Life - Around the Web
Caleb Kraft

Surprise TOQ Teardown at EELive!
Caleb Kraft
Post a comment
This year, for EELive! I had a little surprise that I was quite eager to share. Qualcomm had given us a TOQ smart watch in order to award someone a prize. We were given complete freedom to ...

Design Contests & Competitions
Caleb Kraft

Join The Balancing Act With April's Caption Contest
Caleb Kraft
57 comments
Sometimes it can feel like you're really performing in the big tent when presenting your hardware. This month's caption contest exemplifies this wonderfully.

Engineering Investigations
Caleb Kraft

Frankenstein's Fix: The Winners Announced!
Caleb Kraft
8 comments
The Frankenstein's Fix contest for the Tektronix Scope has finally officially come to an end. We had an incredibly amusing live chat earlier today to announce the winners. However, we ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)