Junko, you noted quite correctly in your comments below on mass production moving out of EU (& US for that matter). The question then is how is this initiative going to identifiy & address the 'value-add' portion of the manufacturing of the ESiP and implement those in to processes that can stay on-shore in EU? I understand this is a high level news release so details are lacking.
Of the four objectives of ESiP -reliability, FA, Final Testing & SiP test vehicles are typically what all new R&D initiatives start with and most often end up transferring the knowledge from these into manufacturing off-shore for high volume.
Heterogeneous 3D integration has been talked about (including in this report) in the industry a lot but I have not seen that triggering either a plethora of new products nor new ASIC startups of tomorrow. The ones that are announcing (like Samsung in its stacked xDRAM and alliances like Memory Hypercube) are all existing big companies that have the resources to take on such ventures. I hope there is some outcome from ESiP initiatives that help smaller businesses and startups to spring up.
I believe there will be increasing innovation in all sorts of packaging as advanceds in Moore's Law come more slowly and at higher expense. It would be interresting if anyone from the project could get on and talk about what they add to what's out there today.
I do wish however all nations and regions could let go of the old thinking about the need for local production. It's a global industry with a global supply chain.
When I read about ESiP project outline, what jumped out of me is the following:
Over the past decade, mass production of micro-/nanoelectronics devices has been moving out of Europe. While automotive and communications domains are still European strongholds, many mass-produced devices, such as memory, have been taken over by non-European producers. One option for bringing volume semiconductor production back to Europe is to establish highly-automated fabrication plants.
I am not certain if the new generation of SiP could be a savior for Europe's microelectornics industry, but I think there is definitely a demand for much more compact SiP.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.