@betajet: My favorite "official" collective noun is "an unkindness of ravens", though I rarely see more than one raven at a time. Groak.
I think that is an entirely appropriate collective noun for Ravens. The cockles of my heart rose in temperature a few degrees when I read that.
I work in the Baltimore, MD area but I'm a native "Warshintonian" from DC, and therefore a fan of the Washington Redskins, no matter how politically incorrect some might think their name is. As a fan of the 'Skins and the Nats, I have to put up with bird crap 10 to 12 months out of the year from the Ravens and Orioles fans at work.
Those would require the carrier for the device -- in some applications it is a viable way to go -- in others where there is not room for the device carriers one must go with underfill and corners method, or look at other approaches -- these also have a bit more lead inductance than a solid ball, and thus affect signal and power integrity in some cases. One may even be left with the choice of mounting bare die on a hybrid package for some appliations (Very high temperature / High vibration - like the engines)
Another very real aspect is the reduction in total solder joints to have as potential failure points with modern VLSI and FPGA packages in BGA and other high density devices. This is partly also addressed via X-ray laminography and conventional X-ray inspection techniques. Some aspects of an aircraft just do not permit BGA's in those locations however.