This is indeed surprise me a bit given Apple has spent so much effort to make iPhone close to perfection. I would think reducing the number of parts will be one of the goals. Having experience working with OEM vendor, I have learned that every screw count. The more part and screws, the more costly it is going to be. On the other hands, I was impressed by how few screws were used in "Made in Japan" products.
Just by looking at the pictures, there seems to be a lot of screws to assemble the phone.
In terms of glue the battery, I don't think it is much of a problem since the 'life' of a phone is about 2 to 3 years. Consumers replace it regardless of the status of the phone. In addition, something is gonna give if the thickness and the weight have to be reduced. Glueing the battery down might actually make sure there is no noise when the phone is shaked.
This article is a good pointer to the IFIXIT's teardown page. Thanks Susan! I just visited IFIXIT website following the link and it was awesome. Many more detailed pictures and lots of information. Several new things apart from the 64-bit A7 processor: such as Dual LED (white and amber LEDs) flash, finger print sensor etc. One the negative side, super-glued battery (not easy to replace), concerns over the possible aging of the cover of the finger print sensor over time. But overall looks like an awesome design. I am from the industrial background and surprised to see so many BGA chips mounted on a compact "logic board" PCB (probably 1X4 inch)...good design!! I saw on they have used a EMI shield on the logic board...that was good.
HM: Thanks for your comment. This is article is an excerpt of iFixit's teardown. You can see the full teardown on iFixit's site. They also have the iPhone 5C. Ifixit's teardown has many more images: EE Times only have permission to use a few images. Thanks.
Apple makes so much of effort to make this beautiful product. Wht not spare more time and give better teardown? We need to understand more to list of parts and images. How about metal aspect, optical technology, logic behind employing new material technology etc.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.