This is indeed surprise me a bit given Apple has spent so much effort to make iPhone close to perfection. I would think reducing the number of parts will be one of the goals. Having experience working with OEM vendor, I have learned that every screw count. The more part and screws, the more costly it is going to be. On the other hands, I was impressed by how few screws were used in "Made in Japan" products.
Just by looking at the pictures, there seems to be a lot of screws to assemble the phone.
In terms of glue the battery, I don't think it is much of a problem since the 'life' of a phone is about 2 to 3 years. Consumers replace it regardless of the status of the phone. In addition, something is gonna give if the thickness and the weight have to be reduced. Glueing the battery down might actually make sure there is no noise when the phone is shaked.
@CEO, for complete details of our analysis on over 2500 devices you can check out our reports at our website, in the searchable eStore, and at the bottom of our all our teardowns are the links to the available completed reports on devices in the iphone5S, for the newer discovered devices like M7, the reports are in the works, custom targeted analysis of process, circuit, systems, software and applied patents is also available. The blog posts represent the breaking news; the devil is in the complex details, where innovation, technology and design intersect. It has been said that true innovation is indiscernible from Magic.
Please follow the EETimes teams coverage in the weeks to follow, we at Chipworks will continue to go deeper on all the aspects of the technology inside these devices, We are depoting (removing the packaging) and performing detailed analysis of the chips, as I post, stay tuned here and at iFixit and at Chipworks.com. Thanks for you interest. Tom @ Chipworks
This article is a good pointer to the IFIXIT's teardown page. Thanks Susan! I just visited IFIXIT website following the link and it was awesome. Many more detailed pictures and lots of information. Several new things apart from the 64-bit A7 processor: such as Dual LED (white and amber LEDs) flash, finger print sensor etc. One the negative side, super-glued battery (not easy to replace), concerns over the possible aging of the cover of the finger print sensor over time. But overall looks like an awesome design. I am from the industrial background and surprised to see so many BGA chips mounted on a compact "logic board" PCB (probably 1X4 inch)...good design!! I saw on they have used a EMI shield on the logic board...that was good.
HM: Thanks for your comment. This is article is an excerpt of iFixit's teardown. You can see the full teardown on iFixit's site. They also have the iPhone 5C. Ifixit's teardown has many more images: EE Times only have permission to use a few images. Thanks.
Blog Doing Math in FPGAs Tom Burke 2 comments For a recent project, I explored doing "real" (that is, non-integer) math on a Spartan 3 FPGA. FPGAs, by their nature, do integer math. That is, there's no floating-point ...