how come no one is calling EUV program out on recent slip. ASML was suppose to ship like 5 80W source tools this year. Now that has been reduced to 1 and the new target for source power is 70W in 2014.
EUV has missed 10nm or 9nm what what ever you want to call the node in 2017 after 14/16
Directed self assembly has made rapid progress in the last few years. Since it looks like EUV will miss being implemented at the 10 nm node for leading edge companies like Intel, it's now looking like some sort of complimentary lithography scheme using DSA might be ready by the 7 or 5 nm nodes.
I nelgected to note IMEC's CTO told me in the last year one of the programs that got the most ramping up at IMEC was on direct self assembly which they now show in their road map as having a significant role at 5nm helping beyond what EUV can/cannot do.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.