Embedded Systems Conference
Breaking News
Newest First | Oldest First | Threaded View
User Rank
Re: Battle of 3D ICs
chipmonk0   10/22/2013 11:04:38 AM
@Rick :

I wonder if TSMC is now doing REAL 3-d stack ( i,e. TSVs in active dice and stacking them ) or still just 2.5-d ( NO TSVs in the active dice, no active die on top of another ) like their earlier Vertex modules for Xilinx.

Your point about difficulty is however well taken. It took Micron at least 2 years to start sampling their HMC, a true 3-d stack.

But many technical questions ( ideal materials set & process flow, yield, device perf., reliability ) that still need to be settled re: 3-d w/ TSVs.

User Rank
TSV is a very promising technology for 3D
Kinnar   10/22/2013 4:18:10 AM
If it clicks for SMIC then success in developing and implementing TSV technology will be game changing success for them, as further acceptance of 3D manufacturing of silicon is totally dependent of the success of TSV.

User Rank
Re: Battle of 3D ICs
junko.yoshida   10/21/2013 11:41:25 PM
Rick, that's definitely a good data point.

rick merritt
User Rank
Re: Battle of 3D ICs
rick merritt   10/21/2013 11:37:46 PM
Interesting the SMIC news comes the same day TSMC announced it was finally in volume production of Xilinx 2.5-D FPGAs. TSMC was early here and it seems the tech is harder than anyone thought.

User Rank
Battle of 3D ICs
junko.yoshida   10/21/2013 10:42:18 PM
What's clear from SMIC's announcement today is the emerging battle -- over who gets more market share -- in the 3D IC foundry business.

Do you see any foundries doing better than others when it comes to producing TSV technology-based stacked devices?

Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll