Breaking News
Comments
Newest First | Oldest First | Threaded View
chipmonk0
User Rank
Manager
Re: Battle of 3D ICs
chipmonk0   10/22/2013 11:04:38 AM
NO RATINGS
@Rick :

I wonder if TSMC is now doing REAL 3-d stack ( i,e. TSVs in active dice and stacking them ) or still just 2.5-d ( NO TSVs in the active dice, no active die on top of another ) like their earlier Vertex modules for Xilinx.

Your point about difficulty is however well taken. It took Micron at least 2 years to start sampling their HMC, a true 3-d stack.

But many technical questions ( ideal materials set & process flow, yield, device perf., reliability ) that still need to be settled re: 3-d w/ TSVs.

Kinnar
User Rank
CEO
TSV is a very promising technology for 3D
Kinnar   10/22/2013 4:18:10 AM
NO RATINGS
If it clicks for SMIC then success in developing and implementing TSV technology will be game changing success for them, as further acceptance of 3D manufacturing of silicon is totally dependent of the success of TSV.

junko.yoshida
User Rank
Blogger
Re: Battle of 3D ICs
junko.yoshida   10/21/2013 11:41:25 PM
NO RATINGS
Rick, that's definitely a good data point.

rick merritt
User Rank
Blogger
Re: Battle of 3D ICs
rick merritt   10/21/2013 11:37:46 PM
NO RATINGS
Interesting the SMIC news comes the same day TSMC announced it was finally in volume production of Xilinx 2.5-D FPGAs. TSMC was early here and it seems the tech is harder than anyone thought.

junko.yoshida
User Rank
Blogger
Battle of 3D ICs
junko.yoshida   10/21/2013 10:42:18 PM
NO RATINGS
What's clear from SMIC's announcement today is the emerging battle -- over who gets more market share -- in the 3D IC foundry business.

Do you see any foundries doing better than others when it comes to producing TSV technology-based stacked devices?



Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Engineer's Bookshelf
Caleb Kraft

The Martian: A Delightful Exploration of Math, Mars & Feces
Caleb Kraft
3 comments
To say that Andy Weir's The Martian is an exploration of math, Mars, and feces is a slight simplification. I doubt that the author would have any complaints, though.

The Engineering Life - Around the Web
Caleb Kraft

Surprise TOQ Teardown at EELive!
Caleb Kraft
Post a comment
This year, for EELive! I had a little surprise that I was quite eager to share. Qualcom had given us a TOQ smart watch in order to award someone a prize. We were given complete freedom to ...

Design Contests & Competitions
Caleb Kraft

Join The Balancing Act With April's Caption Contest
Caleb Kraft
47 comments
Sometimes it can feel like you're really performing in the big tent when presenting your hardware. This month's caption contest exemplifies this wonderfully.

Engineering Investigations
Caleb Kraft

Frankenstein's Fix: The Winners Announced!
Caleb Kraft
8 comments
The Frankenstein's Fix contest for the Tektronix Scope has finally officially come to an end. We had an incredibly amusing live chat earlier today to announce the winners. However, we ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)