Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/30/2013 11:56:34 PM
NO RATINGS
With stacked memory, heat is not as much of an issue, since individual memory locations are accessed only occasionally. But for other types of chips, like processors, the ALUs, for instance, are constantly running making for hot spots that need to be cooled if they are inside the stack.

daleste
User Rank
Author
re:
daleste   10/30/2013 11:29:59 PM
NO RATINGS
WOW, liquid cooling for multichip modules.  I guess at some point, heat has to be addressed.

R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/30/2013 1:06:31 PM
NO RATINGS
Micron and IBM both are using chip stacks connected by through silicon vias (TSVs) and IBM is using microfluidics to run water between the chips to cool them!

wilber_xbox
User Rank
Author
re:
wilber_xbox   10/30/2013 11:19:45 AM
NO RATINGS
there are not a lot of alternatives for 3D stack. I hear that Micron and IBM are working on such a technology. I do not know how the SK Hynix technology is different from the one developed by Micron.

R_Colin_Johnson
User Rank
Author
Re: another alternative
R_Colin_Johnson   10/29/2013 3:49:43 PM
NO RATINGS
One big advantage of BeSang's approach is that its 3-D layers are very thin--less than 0.5 microns--which allows them to use high-density conventional vias, compared to die stacking which requires lower density through-silicon vias.

Regarding whether it will work, SK Hynix has been evaluating BeSang's technology for quite some time, so they--at least--have confidence it will work.

resistion
User Rank
Author
another alternative
resistion   10/29/2013 3:36:07 PM
NO RATINGS
Interesting response to HMC, assuming the low temperature vertical transistors work as desired.

R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/29/2013 1:21:30 PM
NO RATINGS
BeSang claims its approach will enable 3-D memory to be stacked on any type of CMOS chip--not just DRAM--so I expect others to license it soon, now that SK Hynix has taken the plunge. 

wilber_xbox
User Rank
Author
re:
wilber_xbox   10/29/2013 1:11:42 PM
NO RATINGS
Thanks Collin for explanation on the 3D memory stack. After hitting the wall in 2D, the natural choice for more memory in the same area is to stack layers.



Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
8 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll