Breaking News
Comments
wilber_xbox
User Rank
Author
re:
wilber_xbox   10/29/2013 1:11:42 PM
NO RATINGS
Thanks Collin for explanation on the 3D memory stack. After hitting the wall in 2D, the natural choice for more memory in the same area is to stack layers.

R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/29/2013 1:21:30 PM
NO RATINGS
BeSang claims its approach will enable 3-D memory to be stacked on any type of CMOS chip--not just DRAM--so I expect others to license it soon, now that SK Hynix has taken the plunge. 

wilber_xbox
User Rank
Author
re:
wilber_xbox   10/30/2013 11:19:45 AM
NO RATINGS
there are not a lot of alternatives for 3D stack. I hear that Micron and IBM are working on such a technology. I do not know how the SK Hynix technology is different from the one developed by Micron.

R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/30/2013 1:06:31 PM
NO RATINGS
Micron and IBM both are using chip stacks connected by through silicon vias (TSVs) and IBM is using microfluidics to run water between the chips to cool them!

daleste
User Rank
Author
re:
daleste   10/30/2013 11:29:59 PM
NO RATINGS
WOW, liquid cooling for multichip modules.  I guess at some point, heat has to be addressed.

R_Colin_Johnson
User Rank
Author
re:
R_Colin_Johnson   10/30/2013 11:56:34 PM
NO RATINGS
With stacked memory, heat is not as much of an issue, since individual memory locations are accessed only occasionally. But for other types of chips, like processors, the ALUs, for instance, are constantly running making for hot spots that need to be cooled if they are inside the stack.

resistion
User Rank
Author
another alternative
resistion   10/29/2013 3:36:07 PM
NO RATINGS
Interesting response to HMC, assuming the low temperature vertical transistors work as desired.

R_Colin_Johnson
User Rank
Author
Re: another alternative
R_Colin_Johnson   10/29/2013 3:49:43 PM
NO RATINGS
One big advantage of BeSang's approach is that its 3-D layers are very thin--less than 0.5 microns--which allows them to use high-density conventional vias, compared to die stacking which requires lower density through-silicon vias.

Regarding whether it will work, SK Hynix has been evaluating BeSang's technology for quite some time, so they--at least--have confidence it will work.



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
01:34
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...